lead-free parts pb leg3392/s177-pf dual color led lamps ligitek electronics co.,ltd. property of ligitek only data sheet leg3392/s177-pf - 2008 19 - feb. doc. no : qw0905- rev. : a date :
ligitek electronics co.,ltd. property of ligitek only page 1/6 package dimensions part no. leg3392/s177-pf 0 30 75%100% 0 25%50% 60 -30 directivity radiation 50%25% 100%75% -60 note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. g e 1.anode orange 2.common cathode 3.anode green 2 1 3 5.0 5.9 18.0min 0.5 typ 1 2 3 2.54typ 2.0min 2.54typ 2.0min 1.5 max 10.5 0.5 7.6 8.6
2/6 page ligitek electronics co.,ltd. property of ligitek only typical electrical & optical characteristics (ta=25 ) absolute maximum ratings at ta=25 note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. viewing angle 2 1/2 (deg) 70 min. 20 min. forward voltage @ ma(v) max. lens peak wave length pnm spectral halfwidth nm 8.0 1.72.6 45 635 luminous intensity @10ma(mcd) 12 typ. emitted part nomaterial orange leg3392/s177-pf gaasp/gap white diffused color unit ma ma a mw 30 120 g ratings 10 ir -40 ~ +85 -40 ~ +100 100 forward current peak forward current duty 1/10@10khz parameter operating temperature storage temperature reverse current @5v power dissipation symbol t opr tstg i f pd i fp 100 120 30 e gap green5658.0 301.72.61270 part no. leg3392/s177-pf
1.0 r e l a t i v e i n t e n s i t y @ 2 0 m a 0.0 0.5 wavelength (nm) 550600650 ambient temperature( ) fig.5 relative intensity vs. wavelength fig.3 forward voltage vs. temperature f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 -20 -40 0.8 1.0 0.9 1.1 1.2 0.5 r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 -20 ambient temperature( ) 80 60 40 20 0-40 100 0.0 80 60 02040100 fig.4 relative intensity vs. temperature 2.5 1.5 1.0 2.0 3.0 fig.1 forward current vs. forward voltage typical electro-optical characteristics curve 100 f o r w a r d c u r r e n t ( m a ) 0.1 1.0 10 1.0 1000 e chip r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a 0.5 forward voltage(v) 2.03.04.05.01.0 0.0 1.5 1.0 2.0 2.5 forward current(ma) 101001000 fig.2 relative intensity vs. forward current 3.0 ligitek electronics co.,ltd. property of ligitek only 700750 3/6 page part no. leg3392/s177-pf
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 fig.4 relative intensity vs. temperature ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 typical electro-optical characteristics curve forward voltage(v) fig.1 forward current vs. forward voltage f o r w a r d c u r r e n t ( m a ) forward current(ma) fig.2 relative intensity vs. forward current r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a ligitek electronics co.,ltd. property of ligitek only 1.0 0.1 1.0 10 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 500550600650 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20 -40 40 20 080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 3.5 g chip 4/6 page part no. leg3392/s177-pf
page 5/6 2.wave soldering profile soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time only) distance:2mm min(from solder joint to body) ligitek electronics co.,ltd. property of ligitek only 150 time(sec) 260 c3sec max 260 temp( c) 2 /sec max 100 50 preheat 120 25 0 0 note:1.wave solder should not be made more than one time. 2.you can just only select one of the soldering conditions as above. 5 /sec max dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to body) 60 seconds max part no. leg3392/s177-pf
ligitek electronics co.,ltd. property of ligitek only reference standard description mil-std-883:1008 jis c 7021: b-10 jis c 7021: b-12 the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. page 6/6 reliability test: test item high temperature storage test low temperature storage test operating life test test condition 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) mil-std-202:103b jis c 7021: b-11 the purpose of this test is the resistance of the device under tropical for hours. mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 this test intended to see soldering well performed or not. this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. high temperature high humidity test solder resistance test thermal shock test solderability test 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs 1.t.sol=260 5 2.dwell time= 10 1sec. 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles 1.t.sol=230 5 2.dwell time=5 1sec part no. leg3392/s177-pf
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